Name:
3D-ICE
Description:
Thermal simulator for stacked integrated circuits
Professor — Lab:
David AtienzaEmbedded Systems Laboratory

Home page:
3D-ICE
Layman description:
Hardware is getting smaller every day, components are being stacked on top of each other, in order to make theses more compact. But as it is getting smaller, it's also getting hotter. 3D-ICE helps in modelling how thermal flux are behaving.
Documentation:
3D-ICE Docs
Papers:
Project status:
inactive — entered showcase: 2022-07-05 — entry updated: 2022-07-05

Source code:
Lab GitHub - last commit: 2022-06-20
Code quality:
This project has not yet been evaluated by the C4DT Factory team. We will be happy to evaluate it upon request.
Project type:
Simulation
Programming language:
C